Si4410DY
Electrical Characteristics @ T J = 25°C (unless otherwise specified)
Parameter
Min.
Typ. Max. Units Conditions
V (BR)DSS
Drain-to-Source Breakdown Voltage
30
––– ––– V V GS = 0V, I D = 250μA
? V (BR)DSS / ? T J
Breakdown Voltage Temp. Coefficient
–––
0.029 –––
V/°C Reference to 25°C, I D = 1mA
?
R DS(on)
Static Drain-to-Source On-Resistance
–––
–––
0.010 0.0135 V GS = 10V, I D = 10A
0.015 0.020 V GS = 4.5V, I D = 5.0A
?
?
V GS(th)
g fs
I DSS
I GSS
Q g
Q gs
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
1.0
–––
–––
–––
–––
–––
–––
–––
––– ––– V V DS = V GS , I D = 250μA
35 ––– S V DS = 15V, I D = 10A
––– 1.0 V DS = 30V, V GS = 0V
μA
––– 25 V DS = 30V, V GS = 0V, T J = 55°C
––– -100 V GS = -20V
nA
––– 100 V GS = 20V
30 45 I D = 10A
5.4 ––– nC V DS = 15V
38 ––– R G = 6.0 ?
Q gd
t d(on)
t r
t d(off)
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
–––
–––
–––
–––
6.5 ––– V GS = 10V, See Fig. 10
11 ––– V DD = 25V
7.7 ––– I D = 1.0A
ns
?
t f
Fall Time
–––
44 ––– R D = 25 ? ,
?
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
–––
–––
–––
1585 ––– V GS = 0V
739 ––– pF V DS = 15V
106 ––– ? = 1.0MHz, See Fig. 9
Source-Drain Ratings and Characteristics
Parameter
Min. Typ. Max. Units
Conditions
I S
I SM
Continuous Source Current
(Diode Conduction) ?
Pulsed Source Current
(Body Diode) ?
–––
–––
–––
–––
2.3
50
A
MOSFET symbol
showing the
integral reverse
p-n junction diode.
G
D
S
V SD
t rr
Diode Forward Voltage
Reverse Recovery Time
–––
–––
0.7
50
1.1
80
V
ns
T J = 25°C, I S = 2.3A, V GS = 0V ?
T J = 25°C, I F = 2.3A
Notes:
? Repetitive rating; pulse width limited by
max. junction temperature.
? Pulse width ≤ 300μs; duty cycle ≤ 2%.
? When mounted on FR4 Board, t ≤ 10 sec
2
? Starting T J = 25°C, L = 8.0mH
R G = 25 ? , I AS = 10A. (See Figure 15)
? I SD ≤ 2.3A, di/dt ≤ 130A/μs, V DD ≤ V (BR)DSS ,
T J ≤ 150°C
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